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R1LV3216R

Features: • Single 2.7~3.6V power supply• Small stand-by current: 4 A (3.0V, typical)• No clocks, No refresh• All inputs and outputs are TTL compatible.• Easy memory expansion by CS1#, CS2, LB# and UB#• Common Data I/O• Three-state outputs: OR-tie Capabili...

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SeekIC No. : 004468954 Detail

R1LV3216R: Features: • Single 2.7~3.6V power supply• Small stand-by current: 4 A (3.0V, typical)• No clocks, No refresh• All inputs and outputs are TTL compatible.• Easy memory ex...

R1LV3216R Data Sheet

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Part Number:
R1LV3216R
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Single 2.7~3.6V power supply
• Small stand-by current: 4 A (3.0V, typical)
• No clocks, No refresh
• All inputs and outputs are TTL compatible.
• Easy memory expansion by CS1#, CS2, LB# and UB#
• Common Data I/O
• Three-state outputs: OR-tie Capability
• OE# prevents data contention on the I/O bus


Pinout

Connection Diagram


Specifications

Parameter Symbol

Value

 unit
Power supply voltage relative to Vss

Vcc

-0.5 to +4.6

 V
Terminal voltage on any pin relative to Vss

VT

-0.5*1 to Vcc+0.3*2

 V
Power dissipation

PT

0.7

 W
Operation temperature

Topr*3

R ver.

 0 to + 70          

I ver.

-40 to +85
Storage temperature range

Tstg

-65 to 150
Storage temperature range under bias Tbias*3

R ver.

0 to +70

I ver.

-40 to +85

Note 1. 2.0V in case of AC (Pulse width 30ns)
2. Maximum voltage is +4.6V.
3. Ambient temperature range depends on R/I-version. Please see table on page 1.


Description

The R1LV3216R Series is a family of low voltage 32-Mbit static RAMs organized as 2,097,152-word by 16-bit, fabricated by Renesas's high-performance 0.15um CMOS and TFT technologies.

The R1LV3216R Series is suitable for memory applications where a simple interfacing, battery operating and battery backup are the important design objectives. The R1LV3216R Series is provided in 48-pin thin small outline package [TSOP (I): 12mm x 20mm with pin pitch of 0.5mm] and 52-pin micro thin small outline package [TSOP (II): 10.79mm x 10.49mm with pin pitch of 0.4mm]. It gives the best solution for compaction of mounting area as well as flexibility of wiring pattern of printed circuit boards.




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