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RC32336

Features: RC32300 32-bit CPU core 32-bit MIPS instruction set Supports big or little endian operation MMU 16-entry TLB Supports variable page sizes and enhanced write algorithm Supports variable number of locked entries 8KB Instruction Cache 2-way set associative LRU replacement algorith...

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RC32336: Features: RC32300 32-bit CPU core 32-bit MIPS instruction set Supports big or little endian operation MMU 16-entry TLB Supports variable page sizes and enhanced write algorithm Supports varia...

RC32336 Data Sheet

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Part Number:
RC32336
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

RC32300 32-bit CPU core
  32-bit MIPS instruction set
  Supports big or little endian operation
  MMU
  16-entry TLB
  Supports variable page sizes and enhanced write algorithm
  Supports variable number of locked entries
  8KB Instruction Cache
  2-way set associative
  LRU replacement algorithm
  4 word line size
  Sub-block ordering
  Word parity
  Per line cache locking
  2KB Data Cache
  2-way set associative
  LRU replacement algorithm
  4 word line size
  Sub-block ordering
  Byte parity
  Per line cache locking
  Can be programmed on a page basis to implement writethrough
   no write allocate, write-through write allocate, or
   write-back algorithms
  Enhanced EJTAG and JTAG Interfaces
  Compatible with IEEE Std. 1149.1-1990


Specifications

Symbol Parameter Min1 Max1 Unit
VCCI/O I/O Supply Voltage -0.6 4.0 V
VCCCore Core Supply Voltage -0.3 3.0 V
VCCPLL PLL Supply Voltage -0.3 3.0 V
Vimin Input Voltage - undershoot -0.6 - V
Vi I/O Input Voltage Gnd VCCI/O+0.6 V
Ta,
Industrial		 Ambient Operating
Temperature		 -40 +85 °C
Ta,
Commercial 		Ambient Operating
Temperature		 0 +70 °C
Tstg Storage Temperature -40 +125 °C

1. Functional and tested operating conditions are given in Table 14. Absolute maximum ratings are stress ratings only,
and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability
or cause permanent damage to the device.


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