Features: • Low leakage, low zener impedance and maximum power dissipation of 500 mW.• Wide spectrum from 1.9V through 38V of zener voltage provide flexible application.• LLD Package is suitable for high density surface mounting and high speed assembly.Specifications Item ...
REJ03G0018-0300Z: Features: • Low leakage, low zener impedance and maximum power dissipation of 500 mW.• Wide spectrum from 1.9V through 38V of zener voltage provide flexible application.• LLD Packa...
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Features: • Low dynamic impedance and low noise in the low current region (approximately 1/1...
Features: • Low leakage, low zener impedance and maximum power dissipation of 500 mW are ide...
Features: • Low leakage, low zener impedance and maximum power dissipation of 500 mW are ide...
|
Item |
Symbol |
Value |
Unit |
| Power dissipation |
Pd* |
500 |
mW |
| Junction temperature |
Tj |
175 |
°C |
| Storage temperature |
Tstg |
−55 to +175 |
°C |