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REJ03G0018-0300Z

Features: • Low leakage, low zener impedance and maximum power dissipation of 500 mW.• Wide spectrum from 1.9V through 38V of zener voltage provide flexible application.• LLD Package is suitable for high density surface mounting and high speed assembly.Specifications Item ...

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REJ03G0018-0300Z: Features: • Low leakage, low zener impedance and maximum power dissipation of 500 mW.• Wide spectrum from 1.9V through 38V of zener voltage provide flexible application.• LLD Packa...

REJ03G0018-0300Z Data Sheet

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Part Number:
REJ03G0018-0300Z
Supply Ability:
5000

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  • 1~5000
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  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Low leakage, low zener impedance and maximum power dissipation of 500 mW.
• Wide spectrum from 1.9V through 38V of zener voltage provide flexible application.
• LLD Package is suitable for high density surface mounting and high speed assembly.


Specifications

Item
Symbol
Value
Unit
Power dissipation
Pd*
500
mW
Junction temperature
Tj
175
°C
Storage temperature
Tstg
−55 to +175
°C
Note: With P.C. Board.


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