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RFD4N06LSM

Features: • 4A, 60V• rDS(ON) = 0.600W• Design Optimized for 5 Volt Gate Drive• Can be Driven Directly From Q-MOS, N-MOS, or TTL Circuits• SOA is Power Dissipation Limited• 175oC Rated Junction Temperature• Logic Level Gate• High Input Impedance•...

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SeekIC No. : 004476516 Detail

RFD4N06LSM: Features: • 4A, 60V• rDS(ON) = 0.600W• Design Optimized for 5 Volt Gate Drive• Can be Driven Directly From Q-MOS, N-MOS, or TTL Circuits• SOA is Power Dissipation Limit...

RFD4N06LSM Data Sheet

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Part Number:
RFD4N06LSM
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• 4A, 60V
• rDS(ON) = 0.600W
• Design Optimized for 5 Volt Gate Drive
• Can be Driven Directly From Q-MOS, N-MOS, or TTL Circuits
• SOA is Power Dissipation Limited
• 175oC Rated Junction Temperature
• Logic Level Gate
• High Input Impedance
• Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"


Specifications
RFD4N06L
RFD4N06LSM
UNITS
Drain to Source Voltage (Note 1) VDSS
60
V
Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR
60
V
Continuous (Figure 2)ID
16
A
Pulsed Drain Current (Note 3) IDM
Refer to Peak Current Curve
A
Gate to Source Voltage VGS
±10
V

Pulsed Drain Current IDM

4
W
Power Dissipation
10
Derate above 25oC
0.20
W/oC
Pulsed Avalanche Rating UIS
Refer to UIS SOA
Operating and Storage Temperature .TJ, TSTG
-55 to 75
o C
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s TL
300
o C
Package Body for 10s, See Techbrief 334 Tpkg
260
o C



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