RFP30N06LE

MOSFET TO-220AB N-Ch Power

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SeekIC No. : 00161071 Detail

RFP30N06LE: MOSFET TO-220AB N-Ch Power

floor Price/Ceiling Price

Part Number:
RFP30N06LE
Mfg:
Fairchild Semiconductor
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/26

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 60 V
Gate-Source Breakdown Voltage : - 8 V, + 10 V Continuous Drain Current : 30 A
Resistance Drain-Source RDS (on) : 0.047 Ohms Configuration : Single
Maximum Operating Temperature : + 175 C Mounting Style : Through Hole
Package / Case : TO-220AB Packaging : Tube    

Description

Transistor Polarity : N-Channel
Configuration : Single
Maximum Operating Temperature : + 175 C
Mounting Style : Through Hole
Packaging : Tube
Package / Case : TO-220AB
Continuous Drain Current : 30 A
Drain-Source Breakdown Voltage : 60 V
Gate-Source Breakdown Voltage : - 8 V, + 10 V
Resistance Drain-Source RDS (on) : 0.047 Ohms


Features:

• 30A, 60V
• r DS(ON) = 0.047W
• 2kV ESD Protected
• Temperature Compensating PSPICE™ Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
   - TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"



Specifications

      UNITS
Drain to Source Voltage (Note 1) VDSS 60 V
Drain to Gate Voltage (RGS = 20kW)(Note 1) VDGR 60 V
Gate to Source Voltage VGS ±10,8 V
Continuous Drain Current ID 30 A
Pulsed Drain Current (Note 3) IDM Refer to Peak Current Curve  
Single Pulse Avalanche Rating EAS Refer to UIS Curve  
Power Dissipation PD 96 W
Derate Above 25   0.645 W/
Electrostatic Discharge Rating, MIL-STD-883, Category B(2). ESD 2 kV
Operating and Storage Temperature TJ, TSTG -55 to 175
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s.
Package Body for 10s, See Techbrief 334
T L
Tpkg
300
260

CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.





Description

These are N-Channel power MOSFETs RFP30N06LE manufactured using the MegaFET process. This process, which uses feature
sizes approaching those of LSI integrated circuits gives optimum utilization of silicon, resulting in outstanding performance. They were designed for use in applications  such as switching regulators, switching converters, motor drivers and relay drivers. These transistors RFP30N06LE can be operated directly from integrated circuits.

These transistors RFP30N06LE incorporate ESD protection and are designed to withstand 2kV (Human Body Model) of ESD.

Formerly developmental type TA49027.




Parameters:

Technical/Catalog InformationRFP30N06LE
VendorFairchild Semiconductor
CategoryDiscrete Semiconductor Products
Mounting TypeThrough Hole
FET PolarityN-Channel
Drain to Source Voltage (Vdss)60V
Current - Continuous Drain (Id) @ 25° C30A
Rds On (Max) @ Id, Vgs47 mOhm @ 30A, 5V
Input Capacitance (Ciss) @ Vds 1350pF @ 25V
Power - Max96W
PackagingTube
Gate Charge (Qg) @ Vgs62nC @ 10V
Package / CaseTO-220AB
FET FeatureLogic Level Gate
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names RFP30N06LE
RFP30N06LE



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