RFP30P06

MOSFET TO-247 P-Ch Power

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SeekIC No. : 00165390 Detail

RFP30P06: MOSFET TO-247 P-Ch Power

floor Price/Ceiling Price

Part Number:
RFP30P06
Mfg:
Fairchild Semiconductor
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/27

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Product Details

Quick Details

Transistor Polarity : P-Channel Drain-Source Breakdown Voltage : - 60 V
Gate-Source Breakdown Voltage : +/- 20 V Continuous Drain Current : 30 A
Resistance Drain-Source RDS (on) : 0.065 Ohms Configuration : Single
Maximum Operating Temperature : + 175 C Mounting Style : Through Hole
Package / Case : TO-220AB    

Description

Packaging :
Gate-Source Breakdown Voltage : +/- 20 V
Configuration : Single
Maximum Operating Temperature : + 175 C
Mounting Style : Through Hole
Transistor Polarity : P-Channel
Package / Case : TO-220AB
Continuous Drain Current : 30 A
Drain-Source Breakdown Voltage : - 60 V
Resistance Drain-Source RDS (on) : 0.065 Ohms


Features:

• 30A, 60V
• r DS(ON) = 0.065W
• Temperature Compensating PSPICE® Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• 175 Operating Temperature
• Related Literature
   - TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"



Specifications

      UNITS
Drain to Source Voltage (Note 1) VDSS -60 V
Drain to Gate Voltage (RGS = 20kW)(Note 1) VDGR -60 V
Gate to Source Voltage VGS ±20 V
Continuous Drain Current ID 30 A
Pulsed Drain Current (Note 3) (Figure 5) IDM Refer to Peak Current Curve  
Single Pulse Avalanche Rating (Figure 6) EAS Refer to UIS Curve  
Power Dissipation PD 135 W
Linear Derating Factor   0.9 W/
Operating and Storage Temperature TJ, TSTG -55 to 175
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s.
Package Body for 10s, See Techbrief 334
TL
Tpkg
300
260

CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.





Description

These are P-Channel power MOSFETs RFP30P06 manufactured using the MegaFET process. This process, which uses feature sizes approaching those of LSI circuits, gives optimum utilization of silicon, resulting in outstanding performance. They are designed for use in applications such as switching regulators, switching converters, motor drivers, and relay drivers. These transistors RFP30P06 can be operated directly from integrated circuits.

Formerly developmental type TA09834.




Parameters:

Technical/Catalog InformationRFP30P06
VendorFairchild Semiconductor
CategoryDiscrete Semiconductor Products
Mounting TypeThrough Hole
FET PolarityP-Channel
Drain to Source Voltage (Vdss)60V
Current - Continuous Drain (Id) @ 25° C30A
Rds On (Max) @ Id, Vgs65 mOhm @ 30A, 10V
Input Capacitance (Ciss) @ Vds 3200pF @ 25V
Power - Max135W
PackagingTube
Gate Charge (Qg) @ Vgs170nC @ 20V
Package / CaseTO-220AB
FET FeatureStandard
Lead Free StatusContains Lead
RoHS StatusRoHS Non-Compliant
Other Names RFP30P06
RFP30P06



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