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RFP4N06

Features: • 4A, 50V and 60V• rDS(ON) = 0.800W• Related Literature- TB334 Guidelines for Soldering Surface Mount Components to PC Boards Specifications RFP4N05 RFP4N06 UNITS Drain to Source Voltage (Note 1) VDSS 50 60 V Drain to Gate Voltage (RGS = 1MW) (Note 1)...

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RFP4N06: Features: • 4A, 50V and 60V• rDS(ON) = 0.800W• Related Literature- TB334 Guidelines for Soldering Surface Mount Components to PC Boards Specifications RFP4N05 RFP4N06 UNI...

RFP4N06 Data Sheet

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Part Number:
RFP4N06
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• 4A, 50V and 60V
• rDS(ON) = 0.800W
• Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"


Specifications

  RFP4N05 RFP4N06 UNITS
Drain to Source Voltage (Note 1) VDSS 50 60 V
Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR 50 60 V
Continuous Drain Current ID 4 4 A
Pulsed Drain Current (Note 3) IDM 10 10 A
Gate to Source Voltage VGS ±20 ±20 V
Maximum Power Dissipation PD 25 25 W
Linear Derating Factor 0.2 0.2 W/o Caaa
Operating and Storage Temperature .TJ, TSTG -55 to 150 -55 to 150 o C
Maximum Temperature for Soldering      
Leads at 0.063in (1.6mm) from Case for 10s. TL 300 300 o C
Package Body for 10s, See Techbrief 334 Tpkg 260 260 o C



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