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RFT3055LE

Features: • 2.0A, 60V• rDS(ON) = 0.150W• 2kV ESD Protected• Temperature Compensating PSPICE® Model• Thermal Impedance SPICE Model• Peak Current vs Pulse Width Curve• UIS Rating Curve• Related Literature- TB334, Guidelines for Soldering Surface M...

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RFT3055LE: Features: • 2.0A, 60V• rDS(ON) = 0.150W• 2kV ESD Protected• Temperature Compensating PSPICE® Model• Thermal Impedance SPICE Model• Peak Current vs Pulse Width...

RFT3055LE Data Sheet

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Part Number:
RFT3055LE
Supply Ability:
5000

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  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• 2.0A, 60V
• rDS(ON) = 0.150W
• 2kV ESD Protected
• Temperature Compensating PSPICE® Model
• Thermal Impedance SPICE Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
- TB334, "Guidelines for Soldering Surface Mount Components to PC Boards"


Specifications

  RFW2N06RLE
 UNITS
Drain to Source Breakdown Voltage (Note 1) . . . . VDS

 60

V
Package Body for 10s, See Techbrief 334 . . . . . . . . . .Tpkg 60 V
Drain to Gate Voltage (RGS = 20kW) (Note 1) . . . .VDGR 2 V
Continuous Drain Current . . . . . . . . . . . .ID 14  
Pulsed Drain Current (Note 3) . . . . . . IDM -5 to 10 A
Gate to Source Voltage . . . . . . . . . . . . VGS 1.09  
Maximum Power Dissipation (Figure 1). . . . . . . . . PD 0.009  
Linear Derating Factor (Figure 1. . . . . . . . Refer to UIS W
Single Pulse Avalanche Energy Rating . . . . . . . EAS Curve
 mW/o C
Electrostatic Discharge Rating, MIL-STD-883, Catagory B(2) .ESD 2 o C
Operating and Storage Temperature . . . . . . . . . . . TJ, TSTG
-55 to 150		  
Maximum Temperature for Soldering 300 o C
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . TL 260 o C



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