Features: SpecificationsDescriptionThe RH1086K has some dice electrical test limits.When parameter is reference voltage,the conditions is IOUT=10mA,TJ=25,(VINVOUT)=3V,the min is 1.238,the max is 1.262,the units is V.When parameter is reference voltage,the conditions is 1.5V(VINVOUT)=15V,the min is...
RH1086K: Features: SpecificationsDescriptionThe RH1086K has some dice electrical test limits.When parameter is reference voltage,the conditions is IOUT=10mA,TJ=25,(VINVOUT)=3V,the min is 1.238,the max is 1.2...
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The RH1086K has some dice electrical test limits.When parameter is reference voltage,the conditions is IOUT=10mA,TJ=25,(VINVOUT)=3V,the min is 1.238,the max is 1.262,the units is V.When parameter is reference voltage,the conditions is 1.5V(VINVOUT)=15V,the min is 1.225,the max is 1.270,the units is V.When parameter is adjust pin current,the conditions is Tj=25,the max is 120,the units is A.When parameter is adjust pin current change,the conditions is 1.5V(VINVOUT)15V,the max is 5,the units is A.
Rad Hard die require special handling as compared to standard IC chips.Rad Hard die are susceptible to surface damage because there is no silicon nitride passivation as on standard die. Silicon nitride protects the die surface from scratches by RH1086K's hard and dense properties. The passivation on Rad Hard die is silicon dioxide that is much "softer" than silicon nitride.LTC recommends that die handling be performed with extreme care so as to protect the die surface from scratches. If the need arises to move the die around from the chip RH1086K tray, use a Teflon-tipped vacuum wand.This wand can be made by pushing a small diameter Teflon tubing onto the tip of a steel-tipped wand. The inside diameter of the Teflon tip should match the die size for efficient pickup. The tip of the Teflon should be cut square and flat to ensure good vacuum to die surface.Ensure the Teflon tip remains clean from debris by inspecting under stereoscope.During die attach, care must be exercised to ensure no tweezers touch the top of the die.