RLP1N08LE

Features: • 1A, 80V• rDS(ON) = 0.750W• ILIMIT at 150oC = 1.5A Maximum• Built-in Current Limiting• ESD Protected• Controlled Switching Limits EMI and RFI• Specified for 150 Operation• Temperature Compensated Spice Model Provided• Related Literat...

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SeekIC No. : 004477660 Detail

RLP1N08LE: Features: • 1A, 80V• rDS(ON) = 0.750W• ILIMIT at 150oC = 1.5A Maximum• Built-in Current Limiting• ESD Protected• Controlled Switching Limits EMI and RFI• Sp...

floor Price/Ceiling Price

Part Number:
RLP1N08LE
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/26

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Product Details

Description



Features:

• 1A, 80V
• rDS(ON) = 0.750W
• ILIMIT at 150oC = 1.5A Maximum
• Built-in Current Limiting
• ESD Protected
• Controlled Switching Limits EMI and RFI
• Specified for 150 Operation
• Temperature Compensated Spice Model Provided
• Related Literature - TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"



Specifications

Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS                   80               V
Drain to Gate Voltage (RGS = 20kW) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VDGR                    80               V
Electrostatic Voltage at 100pF, 1500W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ESD                   2                 kV
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID                   Self             Limited
Gate to Source Voltage (Reverse Voltage Gate Bias Not Allowed) . . . . . . . . . . . . . . . . . . . . VGS                    5.5              V
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD                    30              W
Power Dissipation Derating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .                    0.24            W/
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG                   -55 to 150    
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL                        300              

Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tpkg                       260              



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