Features: • Interdigitated structure provides high emitter efficiency• Diffused emitter ballasting resistors providing excellent current sharing and withstanding a high VSWR• Gold metallization realizes very stable characteristics and excellent lifetime• Multicell geometry ...
RX1214B300Y: Features: • Interdigitated structure provides high emitter efficiency• Diffused emitter ballasting resistors providing excellent current sharing and withstanding a high VSWR• Gold ...
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• Interdigitated structure provides high emitter efficiency
• Diffused emitter ballasting resistors providing excellent current sharing and withstanding a high VSWR
• Gold metallization realizes very stable characteristics and excellent lifetime
• Multicell geometry improves power sharing and reduces thermal resistance
• Internal input and output matching networks for an easy circuit design.
| SYMBOL | PARAMETER | CONDITIONS | MIN. | MAX. | UNIT |
| VCBO | collector-base voltage | open emitter | - | 65 | V |
| VCES | collector-emitter voltage | RBE =0 Ω | - | 60 | V |
| VEBO | emitter-base voltage | open collector | - | 3 | V |
| IC | collector current (DC) | tp 150 µs; =5% | - | 21 | A |
| Ptot | total power dissipation |
tp 150 µs; =5%; Tmb =75 |
- | 570 | W |
| Tstg | storage temperature | -65 | +200 | ||
| Tj | operating junction temperature | - | 200 | ||
| Tsld | soldering temperature | at 0.2 mm from case; t 10 s | - | 235 |