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S3M/B

Features: · Glass Passivated Die Construction· Low Forward Voltage Drop and High Current Capability· Surge Overload Rating to 100A Peak·Ideally Suited for Automatic AssemblySpecifications Characteristic Symbol S3A/AB S3B/BB S3D/DB S3G/GB S3J/JB S3K/KB S3M/MB Unit ...

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SeekIC No. : 004482243 Detail

S3M/B: Features: · Glass Passivated Die Construction· Low Forward Voltage Drop and High Current Capability· Surge Overload Rating to 100A Peak·Ideally Suited for Automatic AssemblySpecifications Cha...

S3M/B Data Sheet

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Part Number:
S3M/B
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/27

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Product Details

Description



Features:

· Glass Passivated Die Construction
· Low Forward Voltage Drop and High Current Capability
· Surge Overload Rating to 100A Peak
·Ideally Suited for Automatic Assembly


Specifications

Characteristic
Symbol
S3
A/AB
S3
B/BB
S3
D/DB
S3
G/GB
S3
J/JB
S3
K/KB
S3
M/MB
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage

VRRM
VRWM
VR
50
100
200
400
600
800
1000
V
RMS Reverse Voltage VR(RMS)
30
70
140
280
420
560
700
V
Average Rectified Output Current @TL = 75

IO
3.0
A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave superimposed on
rated load (JEDEC Method)
IFSM
100
A
Forward Voltage @IF = 3.0A

VFM
1.15
V
Peak Reverse Current @TA = 25
At Rated DC Blocking Voltage @TA = 125

IRM
10
250
A
Typical Total Capacitance (Note 1)

CT
40
pF
Typical Thermal Resistance Junction to Terminal
(Note 2)		     RJT
10
/w
Operating and Storage Temperature Range

Tj, TSTG
-65 to +150
Notes: 1. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC.
           2. Thermal resistance: Junction to Terminal, unit mounted on PC board with 5.0 mm2 (0.013 mm thick)
               copper pad as heat sink.


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