SB1314E-V

Features: • 1.6mm(L)*0.8mm small size surface mount type • Thin package of 0.4mm(H) thickness • Transparent clear lens optic • Low power consumption type chip LED • Emitting Light Blue(470nm) • E ; ESD Protected (±2.0kv, 3 times @100pF, 1.5k)Application• L...

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SeekIC No. : 004484482 Detail

SB1314E-V: Features: • 1.6mm(L)*0.8mm small size surface mount type • Thin package of 0.4mm(H) thickness • Transparent clear lens optic • Low power consumption type chip LED • Emi...

floor Price/Ceiling Price

Part Number:
SB1314E-V
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2025/12/26

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Product Details

Description



Features:

• 1.6mm(L)*0.8mm small size surface mount type
• Thin package of 0.4mm(H) thickness
• Transparent clear lens optic
• Low power consumption type chip LED
• Emitting Light Blue(470nm)
• E ; ESD Protected (±2.0kv, 3 times @100pF, 1.5k)





Application

• LCD backlighting
• Keypad backlighting
• Symbol backlighting
• Front panel indicator lamp





Specifications

Characteristic

Symbol

Ratings

Unit

Power Dissipation

PD

75

mW

Forward Current

IF

20

mA

*1
Peak Forward Current

IFP

50

mA

Operating Temperature

Topr

-25∼80

Storage Temperature

Tstg

-30∼100

*2
Soldering Temperature

Tsol

240 for4 seconds

*1.Duty ratio = 1/16, Pulse width = 0.1ms
*2. Recommended soldering Temperature Profile 2-1) Preheating 100 to 150 within 2 minutes Soldering 240 within 5 secondsGradual cooling (Avoid quenching)






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