SB830

Features of the SB830 are:(1)epitaxial construction for chip;(2)high current capability;(3)low forward voltage drop;(4)low power loss, high efficiency;(5)high surge capability;(6)high temperature soldering guaranteed:260/10sec/0.375"(9.5mm) lead length at 5 lbs tension.

Mechanical data of the SB830 are:(1)case:Molded with UL-94 Class V-O recognized flame retardant epoxy;(2)terminal:plated leads solderable per MIL-STD 202E, method 208C;(3)polarity is as marked;(4)mounting position is any.

The absolute maximum ratings of the SB830 can be summarized as:(1):the parameter is maximum recurrent peak reverse voltage,the symbol is VRRM,the rating is 30,the unit is V;(2):the parameter is maximum RMS voltage,the symbol is VRMS,the rating is 21,the unit is V;(3):the parameter is maximum DC blocking voltage,the symbol is VDC,the rating is 30,the unit is V;(4):the parameter is maximum average forward recified current at Tc=95,the symbol is IF(AV),the rating is 8.0,the unit is A;(5):the parameter is peak forward surge current,single sine wave superimposed on rated load (JEDEC method),the symbol is IFSM,the rating is 150,the unit is A;(6):the parameter is maximum reverse current at rated DC @ TA=25,the symbol is IR,the rating is 5.0,the unit is mA;(7):the parameter is maximum instantaneous forward voltage drop per element at specified current,the symbol is VF,the rating is 0.65,the unit is V;(8):the parameter is bolocking voltage per element @ TA=100,the symbol is IR,the rating is 50.0,the unit is mA;(9):the parameter is operating junction temperature range,the symbol is TJ,the rating is -65 to +125,the unit is ;(11):the parameter is maximum thermal resistance,the symbol is RJA,the rating is 2.5,the unit is /W;(12):the parameter is storage temperature range,the symbol is Tstg,the rating is -65 to +150,the unit is .