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SBR2M30P1

Features: • Ultra Low Leakage Current• Excellent High Temperature Stability• Superior Reverse Avalanche Capability• Patented Interlocking Clip Design for High Surge Current Capacity• Patented Super Barrier Rectifier Technology• Soft, Fast Switching Capability...

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SeekIC No. : 004485213 Detail

SBR2M30P1: Features: • Ultra Low Leakage Current• Excellent High Temperature Stability• Superior Reverse Avalanche Capability• Patented Interlocking Clip Design for High Surge Current C...

SBR2M30P1 Data Sheet

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Part Number:
SBR2M30P1
Supply Ability:
5000

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Product Details

Description



Features:

• Ultra Low Leakage Current
• Excellent High Temperature Stability
• Superior Reverse Avalanche Capability
• Patented Interlocking Clip Design for High Surge Current Capacity
• Patented Super Barrier Rectifier Technology
• Soft, Fast Switching Capability
• 175ºC Operating Junction Temperature
• ±16KV ESD Protection (HBM, 3B)
• ±25KV ESD Protection (IEC61000-4-2 Level 4, Air Discharge)
• Lead Free Finish, RoHS Compliant (Note 1)
• "Green" Molding Compound (No Br, Sb)
• Qualified to AEC-Q 101 Standards for High Reliability




Specifications

Product Type SBR
Part Number SBR2M30P1
Max Average Rectified Current IO (A) 2
@ Terminal Temperature TT (oC) 75
Peak Repetitive Reverse Voltage VRRM (V) 30
Peak Forward Surge Current IFSM (A) 75
Forward Voltage Drop VF (V) 0.46
@ IF (A) 2
Max Reverse Current IR (mA) 0.2
@ VR (V) 30
Total Capacitance CT (pF) 600


Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage		 VRRM
VRWM
VRM		 30 v
RMS Reverse Voltage VR(RMS) 21 v
Average Rectified Output Current (See Figure 1) IO 2.0 A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load		 IFSM 75 A
Non-Repetitive Avalanche Energy
(TJ = 25°C, IAS = 5A, L = 8.5 mH)		 EAS 105 mJ
Repetitive Peak Avalanche Energy
(1s, 25°C)		 PARM 1100 W
Maximum Thermal Resistance
Thermal Resistance Junction to Soldering (Note 2)
Thermal Resistance Junction to Ambient (Note 3)
Thermal Resistance Junction to Ambient (Note 4)		 RӨJS
RӨJA
RӨjA		 5
183
125		 °C/W
Operating and Storage Temperature Range TJ, TSTG -65 to +175 ºC
Notes: 1. RoHS revision 13.2.2003. High temperature solder exemption applied, see EU Directive Annex Note 7.
2. Theoretical RӨJS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
3. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf. 4. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf




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