SCPS057

Features: • Ability to wake from D3hot and D3cold• Full compatiblity with the Intel 430TX (Mobile Triton II) chipset• A 144-terminal low-profile QFP (PGE), 144-terminal MicroStar BGA ball grid array (GGU) package, or 209-terminal MicroStar BGA (GHK) package•...

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SCPS057 Picture
SeekIC No. : 004486098 Detail

SCPS057: Features: • Ability to wake from D3hot and D3cold• Full compatiblity with the Intel 430TX (Mobile Triton II) chipset• A 144-terminal low-profile QFP (PGE), 144-terminal MicroStar B...

floor Price/Ceiling Price

Part Number:
SCPS057
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/26

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Product Details

Description



Features:

• Ability to wake from D3hot and D3cold
• Full compatiblity with the Intel 430TX (Mobile Triton II) chipset
• A 144-terminal low-profile QFP (PGE), 144-terminal MicroStar BGA ball grid array (GGU) package, or 209-terminal MicroStar BGA (GHK) package
• 3.3-V core logic with universal PCI interfaces compatible with 3.3-V and 5-V PCI signaling environments
• Mix-and-match 5-V/3.3-V 16-bit PC Cards and 3.3-V CardBus Cards
• Single PC Card or CardBus slot with hot insertion and removal
• Burst transfers to maximize data throughput on the PCI bus and the CardBus bus
• Parallel PCI interrupts, parallel ISA IRQ and parallel PCI interrupts, serial ISA IRQ with parallel PCI interrupts, and serial ISA IRQ and PCI interrupts
• Serial EEPROM interface for loading subsystem ID and subsystem vendor ID
• Pipelined architecture allows greater than 130 Mbit/s sustained throughput from CardBus to PCI and from PCI to CardBus
12
• Interface to parallel single-slot PC Card power-switch interfaces like the TI TPS2211 device
• Up to five general-purpose I/Os
• Programmable output select for CLKRUN
• Five PCI memory windows and two I/O windows available to the 16-bit PC Card socket
• Two I/O windows and two memory windows available to the CardBus socket
• Exchangeable card architecture (ExCA) compatible registers are mapped in memory and I/O space
• Compatibility with Intel 82365SL-DF and 82365SL registers
• Distributed DMA (DDMA) and PC/PCI DMA
• 16-bit DMA on the PC Card socket
• Ring indicate, SUSPEND, PCI CLKRUN, and CardBus CCLKRUN
• Socket-activity LED pins
• PCI bus lock (LOCK)
• Advanced submicron, low-power CMOS technology
• Internal ring oscillator



Application

• P2C power-switch interface
• Zoomed-video (ZV) support
• Speaker and audio applications
• LED socket activity indicators
• PC Card-16 DMA support
• PC Card controller programming model
• CardBus socket registers



Pinout

  Connection Diagram


Specifications

Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 4.6 V
Clamping voltage range, VCCP, VCCCB, VCCI . . . . . . . . . . . . . . . . . . . . .0.5 V to 6 V
Input voltage range, VI: PCI . . . . . . . . . . . . . . . . . . . . . . . . . .0.5 V to VCCP + 0.5 V
Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.5 to VCCCB + 0.5 V
Miscellaneous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 to VCCI + 0.5 V
Fail safe . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.5 V to VCC + 0.5 V
Output voltage range, VO: PCI . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to VCC + 0.5 V
Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.5 to VCC + 0.5 V
Miscellaneous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.5 to VCC + 0.5 V
Fail safe . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 2) . . . . . . . . . . . . ±20 mA
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . .65°C to 150°C
Virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .150°C



Description

The PCI1410A device is packaged in either a 144-terminal GGU MicroStar BGA or a 144-terminal PGE package. It also is packaged in a 209-terminal GHK MicroStar BGA that is pin-compatible with the TI PCI4410A device. The PCI4410A device is a single-socket CardBus bridge with integrated OHCI link. Figure 21 is a PGE-package terminal diagram showing PCI-to-CardBus signal names. Figure 22 is a PGE-package terminal diagram showing PCI-to-PC Card signal names. Figure 23 and Figure 24 are terminal diagrams for the GGU and GHK packages, respectively.




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