Features: `-5.4A, -200V, RDS(on) = 0.8 @VGS = -10 V`Low gate charge ( typical 33 nC)`Low Crss ( typical 45 pF)`Fast switching`100% avalanche tested`Improved dv/dt capabilitySpecifications Symbol Parameter SFR9230B / SFU9230B Units VDSS Drain-Source Voltage -200 V ...
SFU9230B: Features: `-5.4A, -200V, RDS(on) = 0.8 @VGS = -10 V`Low gate charge ( typical 33 nC)`Low Crss ( typical 45 pF)`Fast switching`100% avalanche tested`Improved dv/dt capabilitySpecifications Sym...
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Symbol |
Parameter |
SFR9230B / SFU9230B |
Units |
VDSS |
Drain-Source Voltage |
-200 |
V |
ID |
Drain Current - Continuous (TC=25) |
-5.4 |
A |
-3.4 |
A | ||
IDM |
Drain Current - Pulsed (Note 1) |
-22 |
A |
VGS |
Gate-Source Voltage |
±30 |
V |
EAS |
Single Pulsed Avalanche Energy (Note 2) |
390 |
mJ |
IAR |
Avalanche Current (Note 1) |
-5.4 |
A |
EAR |
Repetitive Avalanche Energy (Note 1) |
4.9 |
mJ |
dv/dt |
Peak Diode Recovery dv/dt (Note 3) |
-5.5 |
V/ns |
PD |
Power Dissipation (TA=25) * |
2.5 |
W |
Power Dissipation (TC=25) - Derate above 25°C |
49 |
W | |
0.39 |
W/°C | ||
TJ,TSTG |
Operating and Storage Temperature Range |
-55 to +150 |
°C |
TL |
Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds |
300 |
°C |