Features: • Extreme miniaturization achieved by adopting a miniature molded package (MCP6: 2.0 * 1.25 mm) This IC integrates an oscillator circuit and an output amplifier circuit on a single chip packaged in the MCP6 package for ultracompact surface mounting. Thus this IC can contribute to m...
SMA4201: Features: • Extreme miniaturization achieved by adopting a miniature molded package (MCP6: 2.0 * 1.25 mm) This IC integrates an oscillator circuit and an output amplifier circuit on a single c...
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