SMP18

V_DD to DGND . . . . . . . . . . . . . . . . . . . . . . . ... . . . 0.3 V, 17 V
V_DD to V_SS . . . . . . . . . . . . . . . . . . . . . .  . . . . . . . 0.3 V, 17 V
V_LOGIC to DGND . . . . . . . . . . . . . . . . . . . . .... . . . 0.3 V, V_DD
V_IN to DGND . . . . . . . . . . . . . . . . . . . . . .... . . . . . . . . V_SS, V_DD
V_OUT to DGND . . . . . . . . . . . . . . . . . . . . ... . . . . . . . . V_SS, V_DD
Analog Output Current . . . . . . . . . . . . . .... . . . . . . . . . ±20 mA
                                                      (Not short-circuit protected)
Operating Temperature Range
   FP, FS . . . . . . . . . . . . . . . . . . . . . . ..... . . . . . 40 to +85
Junction Temperature . . . . . . . . . . . . ..... . . . . . . . . . . . +150
Storage Temperature . . . . . . . . . . . . . ... . . . . 65to +150
Lead Temperature (Soldering, 60 sec) . . . . . . .... . . . . . +300

The SMP18 is a monolithic octal sample-and-hold; it has eight internal buffer amplifiers, input multiplexer, and internal hold capacitors. It is manufactured in an advanced oxide isolated CMOS technology to obtain high accuracy, low droop rate, and fast acquisition time. The SMP18 has a typical linearity error of only 0.01% and can accurately acquire a 10-bit input signal to ±1/2 LSB in less than 2.5 microseconds. Its output swing includes the negative supply in both single and dual supply  operation.

The SMP18 was specifically designed for systems that use a calibration cycle to adjust a multiple of system parameters. The low cost and high level of integration make the product  ideal for calibration requirements that have previously required an ASIC, or high cost multiple D/A converters. It is also ideally suited for a wide variety of sampleand- hold applications including amplifier offset or VCA gain adjustments. One or more SMP18s can be used with single or multiple DACs to provide multiple set points within a system.

The SMP18 offers significant cost and size reduction over discrete designs. It is available in a 16-pin plastic DIP, a
narrow body SO-16 surface-mount SOIC package or the thin TSSOP-16 package. It is a higher speed direct
replacement for the SMP08.