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Part Number: SMZG3809B

 

 

 

 

 

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SMZG3809B Maximum Ratings

Operating junction and storage temperature range TJ, TSTG......... - 55 °C to + 150 °C

SMZG3809B Features

• Low profile package
• Ideal for automated placement
• Glass passivated chip junction
• Low Zener impedance
• Low regulation factor
• Meets MSL level 1, per J-STD-020C, LF max peak of 260 °C
• Solder dip 260 °C, 40 seconds
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

SMZG3809B Typical Application

For general purpose regulation and protection applications.

SMZG3809B datasheet

SMZG3809B
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