SMZG3809B Maximum Ratings
Operating junction and storage temperature range TJ, TSTG......... - 55 °C to + 150 °C
SMZG3809B Features
• Low profile package
• Ideal for automated placement
• Glass passivated chip junction
• Low Zener impedance
• Low regulation factor
• Meets MSL level 1, per J-STD-020C, LF max peak of 260 °C
• Solder dip 260 °C, 40 seconds
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
SMZG3809B Typical Application
For general purpose regulation and protection applications.
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