SN54AC240

Features:

EPIC™ (Enhanced-Performance Implanted CMOS) 1-mm Process
Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW), and DIP (N) Packages, Ceramic Chip Carriers (FK), Flat (W), and DIP (J) Packages


Pinout




Specifications

Supply voltage range, V_CC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V
Input voltage range, V_I (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to V_CC + 0.5 V
Output voltage range, V_O (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to V_CC + 0.5 V
Input clamp current, I_IK (V_I < 0 or V_I > V_CC ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, I_OK (V_O < 0 or V_O > V_CC ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, I_O (V_O = 0 to V_CC ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through V_CC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA
Maximum power dissipation at T_A = 55°C (in still air) (see Note 2): DB package . . . . . . . . . . . . . . . . . . . 0.6 W
                                                                                                          DW package  . . . . . . . . . . . . . . . . . . 1.6 W
                                                                                                          N package . . . . . . . . . . . . . . . . . . . . 1.3 W
                                                                                                          PW package  . . . . . . . . . . . . . . . . . . 0.7 W
Storage temperature range, T_stg  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C

‡ Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES:
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils, except for the N package, which has a trace length of zero.


Description

These octal buffers and line drivers of SN54AC240 are designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

The 'AC240 are organized as two 4-bit buffers/drivers with separate output-enable (OE) inputs. When OE is low, the SN54AC240 passes inverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state.

The SN54AC240 is characterized for operation over the full military temperature range of 55°C to 125°C. The SN74AC240 is characterized for operation from 40°C to 85°C.