SN54AC574

· 3-State Outputs Drive Bus Lines Directly
· EPIC^TM (Enhanced-Performance Implanted CMOS) 1-mm Process
· Package Options Include Plastic Small-Outline (DW) Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W), and Standard Plastic (N) and Ceramic (J) DIP Packages

Supply voltage range, V_CC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V
Input voltage range, V_I (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . 0.5 V to V_CC + 0.5 V
Output voltage range, V_O (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . 0.5 V to V_CC + 0.5 V
Input clamp current, I_IK (V_I < 0 or V_I > V_CC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . . . . . . . ±20 mA
Output clamp current, I_OK (V_O < 0 or V_O > V_CC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . . . ±20 mA
Continuous output current, I_O (V_O = 0 to V_CC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through V_CC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA
Maximum power dissipation at T_A = 55°C (in still air) (see Note 2): DB package . . . . . . . . . . . . . 0.6 W
                                                                                                          DW package . . . . . . . . .  . . . 1.6 W
                                                                                                          N package . . . . . . .  . . . .  . . 1.3 W
                                                                                                          PW package . . . . . . . . . . . . . 0.7 W
Storage temperature range, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C

‡ Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils, except for the N package, which has a trace length of zero.

These 8-bit flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. The SN54AC574 is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

The eight flip-flops of the 4AC574 are D-type edge-triggered flip-flops. On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs.

A buffered output-enable (OE) input of SN54AC574 can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the highimpedance state. In the high-impedance state,

the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines in a bus-organized system without need for interface or pullup components.

OE does not affect internal operations of the flip-flop. Old data of SN54AC574 can be retained or new data can be entered while the outputs are in the high-impedance state.

The SN54AC574 is characterized for operation over the full military temperature range of 55°C to 125°C. The SN74AC574 is characterized for operation from 40°C to 85°C.