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MFG:TI D/C:00+


Part Number: SN54S05
MFG: TI
D/C: 00+
Description: These devices contain six independent inverters. To perform correctly, the open-collector outputs requ...
MFG:TI D/C:00+


MFG: TI
D/C: 00+
Description: These devices contain six independent inverters. To perform correctly, the open-collector outputs requ...
These devices contain six independent inverters. To perform correctly, the open-collector outputs require pullup resistors. These devices may be connected to other open-collector outputs to implement active-low wired-OR or active-high wire-AND functions. Open-collector devices often are used to generate high VOH levels.
Supply voltage, VCC (see Note 1): '05, 'LS05, 'S05 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage, VI: '05, 'S05 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
'LS05 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Off-state output voltage, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Package thermal impedance, JA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . 86/W
DB package . . . . . . . . . . . . . . . . . . . . 96/W
N package . . . . . . . . . . . . . . . . . ... . . 80/W
NS package . . . . . . . . . . . . . . . . . . . . 76/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. .. −65 to 150
† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Voltage values are with respect to network ground terminal.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
Package Options Include Plastic Small-Outline (D, NS), Shrink Small-Outline (DB), and Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) DIPs
Dependable Texas Instrument Quality and Reliability
SN54S05
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