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MFG:TI  D/C:SOP  

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Part Number: SN74ABT16244A

 

MFG: TI

 

D/C: SOP

Description: The SN54ABT16244 and SN74ABT16244A are 16-bit buffers and line drivers designed specifically to improve both the perfor...


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SN74ABT16244A General Description


The SN54ABT16244 and SN74ABT16244A are 16-bit buffers and line drivers designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. These devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide true outputs and symmetrical OE (active-low output-enable) inputs.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABT16244 is characterized for operation over the full military temperature range of 55°C to 125°C.

The SN74ABT16244A is characterized for operation from 40°C to 85°C.
 

SN74ABT16244A Maximum Ratings

MIN     MAX UNIT
VCC Supply voltage range 0.5    7
V
VI Input voltage range(2) 0.5    7
V
VO Voltage range applied to any output in the high or power-off state 0.5    5.5
V
IO Current into any output in the ow state
SN54ABT16244
96
mA
SN74ABT16244A
128
IIK Input clamp current VI < 0
18
mA
IOK Output clamp current VO < 0
50
mA

JA Package thermal impedance(3)
DGG package
89
°C/W
DGG package
93
DL package
94
Tstg Storage temperature range
65    150

°C

SN74ABT16244A Features

* Members of the Texas Instruments Widebus(TM) Family
* State-of-the-Art EPIC-IIB(TM) BiCMOS Design Significantly Reduces Power Dissipation
* Latch-Up Performance Exceeds 500 mA Per JESD 70
* Typical VOLP (Output Ground Bounce) <1 V at VCC = 5 V, TA = 25
* Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
* Flow-Through Architecture Optimizes PCB Layout
* High-Drive Outputs (32-mA IOH, 64-mA IOL)
* Package Options Include Plastic 300-mil
   Shrink Small-Outline (DL), Thin Shrink
   Small-Outline (DGG), and Thin Very
   Small-Outline (DGV) Packages and 380-mil
   Fine-Pitch Ceramic Flat (WD) Package
   Using 25-mil Center-to-Center Spacings

SN74ABT16244A Connection Diagram

SN74ABT16244A  Connection Diagram

SN74ABT16244A datasheet

SN74ABT16244A
PDF/DataSheet Download

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