SN74ABT16374

• Member of the Texas Instruments Widebus^TM Family
• State-of-the-Art EPIC-II B^TM BiCMOS Design Significantly Reduces Power Dissipation
• ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
• Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
• Typical V_OLP (Output Ground Bounce) < 1 V at V_CC = 5 V, T_A = 25°C
• Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
• Flow-Through Architecture Optimizes PCB Layout
• High-Drive Outputs (32-mA I_OH, 64-mA I_OL)
• Packaged in Plastic 300-mil Shrink Small-Outline Packages (DL) and 380-mil Fine-Pitch Ceramic Flat Packages (WD) Using 25-mil Center-to-Center Spacings

The 'ABT16374 is a 16-bit edge-triggered D-type flip-flop with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads.  'ABT16374  is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

The  'ABT16374  device can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK) input, the Q outputs of the flip-flop take on the logic levels set up at the data (D) inputs.

A buffered output-enable (OE) input of  'ABT16374  can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without need for interface or pullup components

The output enable (OE) of  'ABT16374  does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

To ensure the high-impedance state of  'ABT16374 during power up or power down, OE should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.The SN74ABT16374 is packaged in TI's shrink small-outline package (DL), which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.The SN54ABT16374 is characterized for operation over the full military temperature range of 55°C to 125°C. The SN74ABT16374 is characterized for operation from 40°C to 85°C.