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MFG:NSC D/C:94


Part Number: SN74ABT244
MFG: NSC
D/C: 94
Description: These octal buffers and line drivers are designed specifically to improve both the performance and den...
MFG:NSC D/C:94


MFG: NSC
D/C: 94
Description: These octal buffers and line drivers are designed specifically to improve both the performance and den...
These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Taken together with the 4ABT240 and 4ABT241, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical active-low output-enable (OE) inputs, and complementary OE and OE inputs.
The 4ABT244 is organized as two 4-bit buffers/line drivers with separate OE inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN74ABT244 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54ABT244 is characterized for operation over the full military temperature range of 55°C to 125°C. The SN74ABT244 is characterized for operation from 40°C to 85°C.
• State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
• Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
• Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
• High-Drive Outputs (32-mA IOH, 64-mA IOL)
• Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), and Plastic (N) and Ceramic (J) DIPs
SN74ABT244
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