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Part Number: SN74ABT652

 

 

 

 

Description: These devices consist of bus transceiver circuits, D-type flip-flops, and control circuitry arranged f...


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SN74ABT652 General Description


These devices consist of bus transceiver circuits, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the data bus or from the internal storage registers. Output-enable (OEAB and OEBA) inputs are provided to control the transceiver functions.

Select-control (SAB and SBA) inputs are provided to select whether real-time or stored data is transferred. The circuitry used for select control eliminates the typical decoding glitch that occurs in a multiplexer during the transition between stored and real-time data. A low input selects real-time data, and a high input selects stored data. Figure 1 illustrates the four fundamental bus-management functions that can be performed with the 4ABT652.

SN74ABT652 Maximum Ratings

Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . ±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA
Package thermal impedance, qJA (see Note 2): DW package . . . . . . . . . . . .81°C/W
NT package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C

SN74ABT652 Features

• State-of-the-Art EPIC-IIBE BiCMOS Design Significantly Reduces Power Dissipation
• ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
• Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
• Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
• High-Drive Outputs (32-mA IOH, 64-mA IOL)
• Package Options Include Plastic Small-Outline ((DW)) and Shrink Small-Outline (DB) Packages, Ceramic Chip Carriers (FK), and Plastic (NT) and Ceramic (JT) DIPs

SN74ABT652 datasheet

SN74ABT652
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