Features: • State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation• ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015• Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17• Typical VOLP (Output Ground Bounce) < 1 V at VCC =...
SN74ABT821: Features: • State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation• ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015• Latch-Up Performance Ex...
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• State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
• ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015
• Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
• Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
• High-Drive Outputs (32-mA IOH, 64-mA IOL)
• Package Options Include Plastic Small-Outline (DW) and Shrink Small-Outline (DB) Packages, Ceramic Chip Carriers (FK), and Plastic (NT) and Ceramic (JT) DIPs

These SN74ABT821 10-bit flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. SN74ABT821 are particularly suitable for implementing wider buffer registers, I/O ports, bidirectional bus drivers with parity, and working registers. The ten flip-flops are edge-triggered D-type flip-flops. On the positive transition of the clock (CLK) input, the device provides true data at the Q outputs.
A buffered output-enable (OE) input of SN74ABT821 can be used to place the ten outputs in either a normal logic state (high or low level) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components.
OE does not affect the internal operations of the latch. Previously stored data can be retained or new data can be entered while the outputs are in the high-impedance state. To ensure the high-impedance state of SN74ABT821 during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN74ABT821 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54ABT821 is characterized for operation over the full military temperature range of 55°C to 125°C. The SN74ABT821 is characterized for operation from 40°C to 85°C.