Features: EPICTM (Enhanced-Performance Implanted CMOS) 1-m ProcessPackage Options Include Plastic Small-Outline (D), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W), and Standard Plastic (N) and Ceramic (J) DIPSPinoutSpecificatio...
SN74AC32: Features: EPICTM (Enhanced-Performance Implanted CMOS) 1-m ProcessPackage Options Include Plastic Small-Outline (D), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic C...
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EPICTM (Enhanced-Performance Implanted CMOS) 1-m Process
Package Options Include Plastic Small-Outline (D), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W), and Standard Plastic (N) and Ceramic (J) DIPS
