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Part Number: SN74ACT244-EP
Description: The SN74ACT244-EP octal buffer/driver is designed specifically to improve the performance and density ...


Description: The SN74ACT244-EP octal buffer/driver is designed specifically to improve the performance and density ...
The SN74ACT244-EP octal buffer/driver is designed specifically to improve the performance and density of
3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.
The device is organized as two 4-bit buffers/drivers with separate output-enable (OE) inputs. When OE is low, the device passes noninverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
| MIN | MAX | UNIT | ||
| VCC Supply voltage range | 0.5 | 7 | V | |
| VI Input voltage range(2) | 0.5 | VCC + 0.5 | V | |
| VO Output voltage range(2) | 0.5 | VCC + 0.5 | V | |
| IIK Input clamp current | VI < 0 or VI > VCC | ±20 | mA | |
| IOK Output clamp current | VO < 0 or VO > VCC | ±20 | mA | |
| IO Continuous output current | VO = 0 to VCC | ±50 | mA | |
| Continuous current through VCC or GND | ±200 | mA | ||
| JA Package thermal impedance(3) | DW package | 58 | /W | |
| NS package | 60 | |||
| Tstg Storage temperature range(4) | 65 | 150 | ||
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are bserved.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
(4) Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of overall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic ackaging.
SN7000
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