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SN74ALVC16240

Features: Member of the Texas Instruments WidebusTM FamilyEPICTM (Enhanced-Performance Implanted CMOS) Submicron ProcessDesigned to Facilitate Incident-Wave Switching for Line Impedances of 50 or GreaterTypical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°CTypical VOHV (Output V...

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SN74ALVC16240: Features: Member of the Texas Instruments WidebusTM FamilyEPICTM (Enhanced-Performance Implanted CMOS) Submicron ProcessDesigned to Facilitate Incident-Wave Switching for Line Impedances of 50 or G...

SN74ALVC16240 Data Sheet

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Part Number:
SN74ALVC16240
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

 Member of the Texas Instruments WidebusTM Family
 EPICTM (Enhanced-Performance Implanted CMOS) Submicron Process
 Designed to Facilitate Incident-Wave Switching for Line Impedances of 50 or Greater
 Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
 Typical VOHV (Output VOH Undershoot) > 2 V at VCC = 3.3 V, TA = 25°C
 Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown
 Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages


Pinout

Connection Diagram


Specifications

Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 4.6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . .. . . . . . 0.5 V to 4.6 V
Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . .  . . . . . . . .0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0 ) . . . . . . . .  . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . -50 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . .±50 mA
Continuous current through VCC or GND  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ... ±100mA
Maximum power package dissipation at TA = 55°C (in still air)(see Note 2): DL package . .. . .0.85W
                                                                                                                      DL package  . . . . .1.2 W
Storage temperature range ,Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . .65°C to 150°C   


Description

This  SN74ALVC16240 16-bit buffer/driver is designed for 2.7-V to 3.6-V VCC operation.

The SN74ALVC16240 is designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. It provides inverting outputs and symmetrical OE (active-low output-enable) inputs.

The SN74ALVC16240 is available in TI's shrink small-outline (DL) and thin shrink small-outline (DGG) packages, which provide twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.

The SN74ALVC16240 is characterized for operation from 40°C to 85°C.




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