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SN74ALVC16245

Features: EPICTM (Enhanced-Performance Implanted CMOS) Submicron ProcessMember of the Texas Instruments WidebusTM FamilyESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)Latch-Up Performance Exceeds 250 mA Per JEDEC Standard JESD-17Bu...

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SN74ALVC16245: Features: EPICTM (Enhanced-Performance Implanted CMOS) Submicron ProcessMember of the Texas Instruments WidebusTM FamilyESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Usi...

SN74ALVC16245 Data Sheet

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Part Number:
SN74ALVC16245
Supply Ability:
5000

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  • 1~5000
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  • Negotiable
  • Processing time
  • 15 Days
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Product Details

Description



Features:

 EPICTM (Enhanced-Performance Implanted CMOS) Submicron Process
 Member of the Texas Instruments WidebusTM Family
 ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
 Latch-Up Performance Exceeds 250 mA Per JEDEC Standard JESD-17
 Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
 Package Options Include Plastic Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages


Pinout

Connection Diagram


Specifications

Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.5 V to 4.6 V
Input voltage range, VI: Except I/O ports (see Note 1) . . . . . . . . . . . . .. . . .   0.5 V to VCC + 4.6 V 
                                       (I/O ports) (see Notes 1 and 2). . . . . . . . . . . . . . . .   0.5 V to VCC + 0.5 V
Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . .  . . .0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . 50 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . .±50 mA
Continuous current through VCC or GND  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ... ±100mA
Maximum power package dissipation at TA = 55°C (in still air)(see Note 3):DGG package  . .  .0.85W
                                                                                                                     DL package . .  .   .1.2 W 
Storage temperature range ,Tstg . . .  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . .65°C to 150°C  


Description

The SN74ALVC16245 16-bit (dual-octal) noninverting bus transceiver is designed for 2.3-V to 3.6-V VCC operation; it is tested at 2.5-V, 2.7-V, and 3.3-V VCC.

The SN74ALVC16245 is designed for asynchronous communication between data buses. The control-function implementation minimizes external timing requirements.

This SN74ALVC16245 can be used as two 8-bit transceivers or one 16-bit transceiver. It allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so that the buses are effectively isolated.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.The SN74ALVC16245 is available in TI's shrink small-outline (DL) and thin shrink small-outline (DGG) packages, which provide twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.

The SN74ALVC16245 is characterized for operation from 40°C to 85°C.




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