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SN74ALVC16409

Features: EPICTM (Enhanced-Performance Implanted CMOS) Submicron ProcessMember of the Texas Instruments Widebus+TM FamilyUBETM (Universal Bus Exchanger) Allows Synchronous Data ExchangeDesigned to Facilitate Incident-Wave Switching for Line Impedances of 50 W or GreaterTypical VOLP (Output Ground ...

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SN74ALVC16409: Features: EPICTM (Enhanced-Performance Implanted CMOS) Submicron ProcessMember of the Texas Instruments Widebus+TM FamilyUBETM (Universal Bus Exchanger) Allows Synchronous Data ExchangeDesigned to F...

SN74ALVC16409 Data Sheet

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Part Number:
SN74ALVC16409
Supply Ability:
5000

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  • 1~5000
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  • 15 Days
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Product Details

Description



Features:

 EPICTM (Enhanced-Performance Implanted CMOS) Submicron Process
 Member of the Texas Instruments Widebus+TM Family
 UBETM (Universal Bus Exchanger) Allows Synchronous Data Exchange
 Designed to Facilitate Incident-Wave Switching for Line Impedances of 50 W or Greater
 Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
 Typical VOHV (Output VOH Undershoot) > 2 V at VCC = 3.3 V, TA = 25°C
 ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
 Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
 Latch-Up Performance Exceeds 250 mA Per JEDEC Standard JESD-17
 Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages


Pinout

Connection Diagram


Specifications

Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.5 V to 4.6 V
Input voltage range, VI: (except I/O ports) (see Note 1) . . . . . . . . . . . .. . . .  . . . . ..0.5 V  to 4.6 V
                                      (I/O ports) (see Notes 1 and 2). . . . . . . . . . . . . . . .   0.5 V to VCC + 0.5 V
Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . .  . . .0.5 V to VCC + 0.5 V
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . .±50 mA
Continuous current through VCC or GND  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ... ±100mA
Maximum power package dissipation at TA = 55°C (in still air)(see Note 3):DGG package  . .  . . 1 W
                                                                                                                     DL package . .. . . . 1.4 W
Storage temperature range ,Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . .65°C to 150°C 


Description

The SN74ALVC16409 allows synchronous data exchange between four different buses.

Data flow is controlled by the select (SEL0SEL4) inputs. A data-flow state is stored on the rising edge of the clock (CLK) input if the select-enable (SELEN) input is low. Once a data-flow state has been established, data is stored in the flip-flop on the rising edge of CLK if SELEN is high. The data-flow control logic is designed to allow glitch-free data transmission.SN74ALVC16409 Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN74ALVC16409 is available in TI's shrink small-outline (DL) and thin shrink small-outline (DGG) packages, which provide twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.

The SN74ALVC16409 is characterized for operation from 40°C to 85°C.




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