Position: Home  > All Categories> Integrated Circuits (ICs) > SN74ALVC16501

SN74ALVC16501

Features: EPICTM (Enhanced-Performance Implanted CMOS) Submicron ProcessMember of the Texas Instruments Widebus+TM FamilyUBETM (Universal Bus Exchanger) Allows Synchronous Data ExchangeESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0...

product image

SN74ALVC16501 Picture
See larger image
SeekIC No. : 004498234 Detail

SN74ALVC16501: Features: EPICTM (Enhanced-Performance Implanted CMOS) Submicron ProcessMember of the Texas Instruments Widebus+TM FamilyUBETM (Universal Bus Exchanger) Allows Synchronous Data ExchangeESD Protectio...

SN74ALVC16501 Data Sheet

floor Price/Ceiling Price

Get Latest Price
Part Number:
SN74ALVC16501
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

SeekIC Buyer Protection PLUS - newly updated for 2013!

  • Escrow Protection.
  • Guaranteed refunds.
  • Secure payments.
  • Learn more >>

Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2025/12/24

add to my favourite

Payment Methods

All payment methods are secure and covered by SeekIC Buyer Protection PLUS.

Notice: When you place an order, your payment is made to SeekIC and not to your seller. SeekIC only pays the seller after confirming you have received your order. We will also never share your payment details with your seller.
Product Details

Description



Features:

 EPICTM (Enhanced-Performance Implanted CMOS) Submicron Process
 Member of the Texas Instruments Widebus+TM Family
 UBETM (Universal Bus Exchanger) Allows Synchronous Data Exchange
 ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
 Latch-Up Performance Exceeds 250 mA Per JEDEC Standard JESD-17
 Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistor
 Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages 




Pinout

Connection Diagram


Specifications

Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.5 V to 4.6 V
Input voltage range, VI: (except I/O ports) (see Note 1) . . . . . . . . . . . .. . . .  . . . . ..0.5 V  to 4.6 V
Input voltage range, VI:(I/O ports) (see Notes 1 and 2). . . . . . . . . . . . . . . .   0.5 V to VCC + 0.5 V
Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . .  . . .0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . 50 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . .±50 mA
Continuous current through VCC or GND  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ... ±100mA
Maximum power package dissipation at TA = 55°C (in still air)(see Note 3):DGG package  . .  . . 1 W
                                                                                                                     DL package . .. . . . 1.4 W
Storage temperature range ,Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . .65°C to 150°C 


Description

The SN74ALVC16501 18-bit universal bus transceiver is designed for low-voltage (3.3-V) VCC operation; it is tested at 2.5-V, 2.7-V, and 3.3-V VCC.

Data flow in each direction is controlled by output-enable (OEAB and OEBA), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the device operates in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a high or low logic level. If LEAB is low, the A-bus data is stored in the latch/flip-flop on the low-to-high transition of CLKAB. When OEAB is high, the outputs are active. When OEAB is low, the outputs are in the high-impedance state. Data flow for B to A is similar to that of A to B but uses OEBA, LEBA, and CLKBA. The output enables are complementary (OEAB is active high and OEBA is active low).The SN74ALVC16501 is available in TI's shrink small-outline (DL) and thin shrink small-outline (DGG) packages, which provide twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.

The SN74ALVC16501 is characterized for operation from 40°C to 85°C.




Customers Who Bought This Item Also Bought

Margin,quality,low-cost products with low minimum orders. Secure your online payments with SeekIC Buyer Protection.
You may also be interested in :
Programmers, Development Systems
ARDUINO IIC/I2C 液晶模块
JTAG-SMT2
Audio Products
HUC1002
WM-64CT
Power Supplies - Board Mount
HC-06
PM150RSA060-S81AH0G
Capacitors
GRM188R71H103KA01D
GRM21BR71H104KA01L
Static Control, ESD, Clean Room Products
DPA5
PA800-A41
Undefined Category
VI-B63-IU
X27 589
View more