SN74AUC1G06

Features: • Available in the Texas Instruments NanoStar ™ and NanoFree ™ Packages• Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation• I off Supports Partial-Power-Down Mode Operation• Sub-1-V Operable• Max t pd ...

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SN74AUC1G06 Picture
SeekIC No. : 004498474 Detail

SN74AUC1G06: Features: • Available in the Texas Instruments NanoStar ™ and NanoFree ™ Packages• Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operat...

floor Price/Ceiling Price

Part Number:
SN74AUC1G06
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/24

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Product Details

Description



Features:

• Available in the Texas Instruments NanoStar ™ and NanoFree ™ Packages
• Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
• I off Supports Partial-Power-Down Mode Operation
• Sub-1-V Operable
• Max t pd of 2.5 ns at 1.8 V
• Low Power Consumption, 10- µ A Max ICC
• ± 8-mA Output Drive at 1.8 V
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Protection Exceeds JESD 22
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Pinout

  Connection Diagram


Specifications

   
MIN
MAX
UNIT
VCC Supply voltage range
0.5
3.6
V
VI Input voltage range (2)
0.5
3.6
V
VO Output voltage range (2)
0.5
VCC + 0.5
V
IIK Input clamp current
50
mA
IOK Output clamp current VI < 0
50
mA
IO Continuous output current VO< 0
± 20
mA
  Continuous current through V CC or GND
± 100
mA
JA Package thermal impedance (3) DBV package
206
°C/W
DCK package
252
YEA/YZA package
154
YEP/YZP package
132
Tstg Storage temperature range
65
150
°C



Description

This SN74AUC1G06 single inverter buffer/driver is operational at 0.8-V to 2.7-V VCC , but is designed specifically for 1.65-V to 1.95-V VCC operation.

The output of the SN74AUC1G06 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions.

SN74AUC1G06 NanoStar ™ and NanoFree ™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.




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