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SN74AUC1G126

Features: ` Available in the Texas Instruments NanoStar and NanoFree Packages` Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation` Ioff Supports Partial-Power-Down Mode Operation` Sub 1-V Operable` Max tpd of 2.5 ns at 1.8 V` Low Power Co...

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SN74AUC1G126: Features: ` Available in the Texas Instruments NanoStar and NanoFree Packages` Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation` Ioff Su...

SN74AUC1G126 Data Sheet

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Part Number:
SN74AUC1G126
Supply Ability:
5000

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  • 1~5000
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  • 15 Days
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Product Details

Description



Features:

` Available in the Texas Instruments
  NanoStar and NanoFree Packages
` Optimized for 1.8-V Operation and Is 3.6-V
  I/O Tolerant to Support Mixed-Mode Signal Operation
` Ioff Supports Partial-Power-Down Mode
  Operation
` Sub 1-V Operable
` Max tpd of 2.5 ns at 1.8 V
` Low Power Consumption, 10-A Max ICC
` ±8-mA Output Drive at 1.8 V
` Latch-Up Performance Exceeds 100 mA Per
  JESD 78, Class II
` ESD Protection Exceeds JESD 22
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
1000-V Charged-Device Model (C101)


Pinout

Connection Diagram


Specifications

Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 3.6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.5 V to 3.6 V
Voltage range applied to any output in the high-impedance or power-off state, VO
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.5 V to 3.6 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50 mA
Continuous output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±100 mA
Package thermal impedance, JA (see Note 2): DBV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .206°C/W
DCK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . . . . . . . . .  252°C/W
YEP/YZP package . . . . . . . . . . . . . . . . . . . . . . . . . . .  . . . . . . . . . . . . . . . . . . . . . . . . . . .  . . . . . . . . . . 132°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C
† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.


Description

This SN74AUC1G126 bus buffer gate is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.

The SN74AUC1G126 is a single line driver with a 3-state output. The output is disabled when the output-enable (OE) input is low.

To ensure the SN74AUC1G126 high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This SN74AUC1G126 device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.




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