Features: ` Available in the Texas Instruments ` Low Power Consumption, 10-mA Max ICC NanoStar™ and NanoFree™ Packages ` ±8-mA Output Drive at 1.8 V` Optimized for 1.8-V Operation and Is 3.6-V I/O ` Latch-Up Performance Exceeds 100 mA Per Tolerant to Support Mixed-Mode Signal JESD 78, ...
SN74AUC1G74: Features: ` Available in the Texas Instruments ` Low Power Consumption, 10-mA Max ICC NanoStar™ and NanoFree™ Packages ` ±8-mA Output Drive at 1.8 V` Optimized for 1.8-V Operation and Is...
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| Symbol | Parameter | MIN | MAX | Units | |
| VCC | Supply voltage range | -0.5 | 3.6 | V | |
| VI | Input voltage range(2) | -0.5 | 3.6 | V | |
| VO | Voltage range applied to any output in the high-impedance or power-off state(2) | -0.5 | 3.6 | V | |
| VO | Output voltage range(2) | -0.5 | VCC + 0.5 | V | |
| IIK | Input clamp current | VI < 0 | -50 | mA | |
| IOK | Output clamp current | VO < 0 | -50 | mA | |
| IO | Continuous output current | ±20 | mA | ||
| ICC | Continuous current through VCC or GND | ±100 | mA | ||
| IANG | Package thermal impedance(3) | DCT package | 220 | °C/W | |
| DCU package | 227 | ||||
| YEP/YZP package | 102 | ||||
| TSTG | Storage temperature range | -65 | 150 | °C | |
This SN74AUC1G74 single positive-edge-triggered D-type flip-flop is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.
A low level at the preset (PRE) or clear (CLR) input sets or resets the outputs, regardless of the levels of the other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time requirements is transferred to the outputs on the positive-going edge of the clock pulse. SN74AUC1G74 Clock triggering occurs at a voltage level and is not related directly to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs. To better optimize the flip-flop for higher frequencies, the CLR input overrides the PRE input when they are both low.
SN74AUC1G74 NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.