Features: ` Available in the Texas Instruments ` Wide Operating VCC Range of 0.8 V to 3.6 V NanoStar™ and NanoFree™ Packages ` Optimized for 3.3-V Operation` Low Static-Power Consumption ` 3.6-V I/O Tolerant to Support Mixed-Mode (ICC = 0.0 mA Max) Signal Operation` Low Dynamic-Power C...
SN74AUP1G125: Features: ` Available in the Texas Instruments ` Wide Operating VCC Range of 0.8 V to 3.6 V NanoStar™ and NanoFree™ Packages ` Optimized for 3.3-V Operation` Low Static-Power Consumption...
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| Symbol | Parameter | MIN | MAX | Units | |
| VCC | Supply voltage range | -0.5 | 4.6 | V | |
| VI | Input voltage range(2) | -0.5 | 4.6 | V | |
| VO | Voltage range applied to any output in the high-impedance or power-off state(2) | -0.5 | 4.6 | V | |
| VO | Output voltage range(2) | -0.5 | VCC + 0.5 | V | |
| IIK | Input clamp current | VI < 0 | -50 | mA | |
| IOK | Output clamp current | VO < 0 | -50 | mA | |
| IO | Continuous output current | ±20 | mA | ||
| ICC | Continuous current through VCC or GND | ±50 | mA | ||
| IANG | Package thermal impedance(3) | DCT package | 206 | °C/W | |
| DCU package | 252 | ||||
| YEP/YZP package | |||||
| TSTG | Storage temperature range | -65 | 150 | °C | |
The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This SN74AUP1G125 family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see Figures 1 and 2).
This SN74AUP1G125 bus buffer gate is a single line driver with a 3-state output. The output is disabled when the output-enable (OE) input is high. This device has the input-disable feature, which allows floating input signals.
To ensure the SN74AUP1G125 high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This SN74AUP1G125 device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.