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SN74AUP1G126YEPR

Features: ` Available in the Texas Instruments NanoStar and NanoFree Packages` Low Static-Power Consumption (ICC = 0.9 A Max)` Low Dynamic-Power Consumption (Cpd = 4 pF Typ at 3.3 V)` Low Input Capacitance (Ci = 1.5 pF Typ)` Low Noise − Overshoot and Undershoot <10% o...

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SN74AUP1G126YEPR: Features: ` Available in the Texas Instruments NanoStar and NanoFree Packages` Low Static-Power Consumption (ICC = 0.9 A Max)` Low Dynamic-Power Consumption (Cpd = 4 pF Typ at 3.3...

SN74AUP1G126YEPR Data Sheet

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Part Number:
SN74AUP1G126YEPR
Supply Ability:
5000

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Product Details

Description



Features:

` Available in the Texas Instruments
  NanoStar and NanoFree Packages
` Low Static-Power Consumption (ICC = 0.9 A Max)
` Low Dynamic-Power Consumption (Cpd = 4 pF Typ at 3.3 V)
` Low Input Capacitance (Ci = 1.5 pF Typ)
` Low Noise − Overshoot and Undershoot <10% of VCC
` Input-Disable Feature Allows Floating Input Conditions
` Ioff Supports Partial-Power-Down Mode Operation
` Input Hysteresis Allows Slow Input
  Transition and Better Switching Noise
  Immunity at Input
` Wide Operating VCC Range of 0.8 V to 3.6 V
` Optimized for 3.3-V Operation
` 3.6-V I/O Tolerant to Support Mixed-Mode
  Signal Operation
` tpd = 4.6 ns Max at 3.3 V
` Suitable for Point-to-Point Applications
` Latch-Up Performance Exceeds 100 mA Per
  JESD 78, Class II
` ESD Performance Tested Per JESD 22
− 2000-V Human-Body Model
  (A114-B, Class II)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
` ESD Protection Exceeds ±5000 V With
  Human-Body Model


Pinout

Connection Diagram


Specifications

Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Voltage range applied to any output in the high-impedance or power-off state, VO
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Output voltage range in the high or low state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .−50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±20 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±50 mA
Package thermal impedance, JA (see Note 2): DBV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206°C/W
DCK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .252°C/W
DRL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .142°C/W
YEP/YZP package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .−65°C to 150°C
† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.


Description

The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This SN74AUP1G126YEPR family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see Figures 1 and 2)

This bus buffer gate SN74AUP1G126YEPR is a single line driver with a 3-state output. The output is disabled when the output-enable (OE) input is low. This device has the input-disable feature, which allows floating input signals. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

SN74AUP1G126YEPR NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device SN74AUP1G126YEPR is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.




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