SN74AVC2T45

Features: ` Available in the Texas Instruments NanoStar™ and NanoFree™ Packages` Control Inputs VIH/VIL Levels Are Referenced to VCCA Voltage` Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 1.2-V to 3.6-V Power-Supply Range` I/Os Are 4.6-V Tolerant` Ioff ...

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SeekIC No. : 004498549 Detail

SN74AVC2T45: Features: ` Available in the Texas Instruments NanoStar™ and NanoFree™ Packages` Control Inputs VIH/VIL Levels Are Referenced to VCCA Voltage` Fully Configurable Dual-Rail Design Allows ...

floor Price/Ceiling Price

Part Number:
SN74AVC2T45
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/24

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Product Details

Description



Features:

` Available in the Texas Instruments NanoStar™ and NanoFree™ Packages
` Control Inputs VIH/VIL Levels Are Referenced to VCCA Voltage
` Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 1.2-V to 3.6-V Power-Supply Range
` I/Os Are 4.6-V Tolerant
` Ioff Supports Partial-Power-Down Mode Operation
` Max Data Rates
  500 Mbps (1.8-V to 3.3-V Translation)
  320 Mbps (<1.8-V to 3.3-V Translation)
  320 Mbps (Translate to 2.5 V or 1.8 V)
  180 Mbps (Translate to 1.5 V)
  240 Mbps (Translate to 1.2 V)
` Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
` ESD Protection Exceeds JESD 22
  2000-V Human-Body Model (A114-A)
  200-V Machine Model (A115-A)
  1000-V Charged-Device Model (C101)




Pinout

  Connection Diagram


Specifications

    MIN MAX UNIT
VCCA
VCCB
Supply voltage range 0.5 4.6 V
VI Input voltage range(2) I/O ports (A port) 0.5 4.6  
I/O ports (B port) 0.5 4.6
Control inputs 0.5 4.6
VO Voltage range applied to any output in the high-impedance or power-off state(2) A port 0.5 4.6 V
B port 0.5 4.6
VO Voltage range applied to any output in the high or low state(2) (3) A port 0.5 VCCA + 4.6 V
B port 0.5 VCCB + 4.6
IIK Input clamp current VI< 0   50 mA
IOK Output clamp current VO< 0   50 mA
IO Continuous output current   ±50 mA
  Continuous current through VCCA,VCCB or GND   ±100 mA
JA Package thermal impedance(4) DCT package   220 °C/W
DCU package   227
YEP/YZP package   102
Tstg Storage temperature range 65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The output positive-voltage rating may be exceeded up to 4.6 V maximum if the output current ratings are observed.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.



Description

This SN74AVC2T45 dual-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCAaccepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.2 V to 3.6 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes.

The SN74AVC2T45 is designed for asynchronous communication between data buses. The device transmits data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input.

The SN74AVC2T45 is designed so that the DIR input is powered by VCCA.

This SN74AVC2T45 device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The SN74AVC2T45 VCC isolation feature ensures that if either VCC input is at GND, both ports are in the high-impedance state. NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.


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