Features: • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers• Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPsPinoutSpecificationsSupply voltage range, VCC . . . . . . . ...
SN74F240: Features: • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers• Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chi...
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These SN74F240 octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Taken together with the 4F241 and 4F244, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical OE (active-low output-enable) inputs, and complementary OE and OE inputs.
The 4F240 is organized as two 4-bit buffers/line drivers with separate output enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state.
The SN74F240 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54F240 is characterized for operation over the full military temperature range of 55°C to 125°C. The SN74F240 is characterized for operation from 0°C to 70°C.