Features: High-Current 3-State Outputs Drive Bus Lines Directly or up to 15 LSTTL Loads Bus-Structured Pinout Package Options Include Plastic Small-Outline (DW) and Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPsPinoutSpecificationsAmbie...
SN74HC563: Features: High-Current 3-State Outputs Drive Bus Lines Directly or up to 15 LSTTL Loads Bus-Structured Pinout Package Options Include Plastic Small-Outline (DW) and Ceramic Flat (W) Packages, Cerami...
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