SN74LV245A General Description
SN74LV245A Maximum Ratings
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.5 V to 7 V
Input voltage range, VI: Except I/O ports (see Note 1) . . . . . . . . . . . . . . . . . . . . .. . . . . . . .0.5 V to 7 V
I/O ports (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . .0.5 V to VCC + 0.5 V
Output voltage range applied in the high or low state, VO (see Notes 1 and 2) . .. . 0.5 V to VCC + 0.5 V
Output voltage range applied in high-impedance or power-off state, VO (see Note 1) . . . . .0.5 V to 7 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . .. .20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ... . . . . .±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±70 mA
Package thermal impedance, JA (see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . .. . . .... . .115/W
DGV package . . . . . . . . . . . . . . . . . . . . . . .. . . . . .146/W
DW package . . . . . . . . . . . . . . . . . . . . . . . .. . . . . .97/W
NS package . . . . . . . . . . . . . . . . . . . . . . . ... . . . .100/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . .. . .128/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ... . .. .65 to 150
SN74LV245A Features
* EPICE (Enhanced-Performance Implanted
CMOS) Process
* Typical VOLP (Output Ground Bounce)
< 0.8 V at VCC, TA = 25
* Typical VOHV (Output VOH Undershoot)
> 2 V at VCC, TA = 25
* Latch-Up Performance Exceeds 250 mA Per
JESD 17
* ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
* Package Options Include Plastic
Small-Outline (DW, NS), Shrink
Small-Outline (DB), Thin Very Small-Outline
(DGV), and Thin Shrink Small-Outline (PW)
Packages, Ceramic Flat (W) Packages, Chip
Carriers (FK), and DIPs (J)
SN74LV245A Connection Diagram
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