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SN74LVC1G332DBVT

Features: ` Available in the Texas Instruments NanoStar™ and NanoFree™™ Packages` Supports 5-V VCC Operation` Inputs Accept Voltages to 5.5 V` Max tpd of 4.5 ns at 3.3 V` Low Power Consumption, 10-A Max ICC` ±24-mA Output Drive at 3.3 V` Ioff Supports Partial-Power-Down Mode Oper...

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SeekIC No. : 004499269 Detail

SN74LVC1G332DBVT: Features: ` Available in the Texas Instruments NanoStar™ and NanoFree™™ Packages` Supports 5-V VCC Operation` Inputs Accept Voltages to 5.5 V` Max tpd of 4.5 ns at 3.3 V` Low Power...

SN74LVC1G332DBVT Data Sheet

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Part Number:
SN74LVC1G332DBVT
Supply Ability:
5000

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  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

` Available in the Texas Instruments NanoStar™ and NanoFree™™ Packages
` Supports 5-V VCC Operation
` Inputs Accept Voltages to 5.5 V
` Max tpd of 4.5 ns at 3.3 V
` Low Power Consumption, 10-A Max ICC
` ±24-mA Output Drive at 3.3 V
` Ioff Supports Partial-Power-Down Mode Operation
` Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
` ESD Protection Exceeds JESD 22
` 2000-V Human-Body Model (A114-A)
` 200-V Machine Model (A115-A)
` 1000-V Charged-Device Model (C101)




Pinout

Connection Diagram


Specifications

 
MIN       MAX
UNIT
VCC       Supply voltage range
0.5           6.5
V
VI          Input voltage range(2)
0.5           6.5
V
VO         Voltage range applied to any output in the high-impedance or power-off state(2)

     0.5          6.5
V
VO         Voltage range applied to any output in the high or low state(2) (3)
0.5  VCC + 0.5
V
IIK         Input clamp current VI < 0
-50
mA
IOK        Output clamp current VO < 0
-50
mA
IO         Continuous output current
±50
mA
             Continuous current through VCC or GND
±100
mA

JA       Package thermal impedance(4)		 D package
165
°C/W
PW package
129
YEP/YZP package
123
Tstg      Storage temperature range
65          150
°C



Description

The SN74LVC1G332 performs the Boolean function in Y = A  B  C or Y =A • B • C positive logic.

NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device SN74LVC1G332 is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.




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