Features: *Available in Texas Instruments NanoStar™ and NanoFree™Packages*Supports 5-V VCC Operation*Inputs Accept Voltages to 5.5 V*One Unbuffered Inverter (SN74LVC1GU04) and One Buffered Inverter (SN74LVC1G04)*Suitable for Commonly Used Clock Frequencies: −15 kH...
SN74LVC1GX04: Features: *Available in Texas Instruments NanoStar™ and NanoFree™Packages*Supports 5-V VCC Operation*Inputs Accept Voltages to 5.5 V*One Unbuffered Inverter (SN74LVC1GU04...
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Supply voltage range, VCC...............................................−0.5 V to 6.5 V
Input voltage range, VI (see Note 1):... ..........................−0.5 V to 6.5 V
Voltage range applied to Y output in the high-impedance
or power-off state, VO (see Note 1) . . . . . . . ..-0.5 V to 6.5 V
Voltage range applied to any output in the high or low state, VO
(see Notes 1 and 2) ............ . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . .. . . .. . . . . . . . . . . −50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . .±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . .. . . .±100 mA
Package thermal impedance, JA (see Note 3):DBV package. . . . .165/W
DCK package . .. . .259/W
YEP/YZP package. .123/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . .. −65 to 150
The SN74LVC1GX04 is designed for 1.65-V to 5.5-V VCC operation. This device incorporates the SN74LVC1GU04 (inverter with unbuffered output) and the SN74LVC1G04 (inverter) functions into a single device. The LVC1GX04 is optimized for use in crystal oscillator applications.
The SN74LVC1GX04 X1 and X2 can be connected to a crystal or resonator in oscillator applications. The device provides an additional buffered inverter (Y) for signal conditioning (see Figure 3). The additional buffered inverter improves the signal quality of the crystal oscillator output by making it rail to rail.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device SN74LVC1GX04 is fully specified for partial-power-down applications using Ioff (Y output only). The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.