SN74LVC2G06

Features:

Available in the Texas Instruments NanoStar and NanoFree Packages
Supports 5-V V_CC Operation
Max t_pd of 3.4 ns at 3.3 V
Low Power Consumption, 10-A Max I_CC
±24-mA Output Drive at 3.3 V
Typical V_OLP (Output Ground Bounce) <0.8 V at V_CC = 3.3 V, T_A = 25°C
Typical V_OHV (Output VOH Undershoot) >2 V at V_CC = 3.3 V, T_A = 25°C
Inputs and Open-Drain Outputs Accept Voltages up to 5.5 V
I_off Supports Partial-Power-Down Mode Operation
Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
ESD Protection Exceeds JESD 22
  − 2000-V Human-Body Model (A114-A)
  − 200-V Machine Model (A115-A)
  − 1000-V Charged-Device Model (C101)


Pinout




Specifications

Supply voltage range, V_CC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V
Input voltage range, V_I (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V
Voltage range applied to any output in the high-impedance or power-off state, V_O
  (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V
Voltage range applied to any output in the high or low state, V_O
  (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V
Input clamp current, I_IK (V_I < 0)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Output clamp current, I_OK (V_O< 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, I_O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through V_CC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
Package thermal impedance, _JA (see Note 3): DBV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165°C/W
                                                                          DCK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 259°C/W
                                                                          YEA/YZA package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143°C/W
                                                                          YEP/YZP package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123°C/W
Storage temperature range, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C

† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES:
1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The value of V_CC is provided in the recommended operating conditions table.
3. The package thermal impedance is calculated in accordance with JESD 51-7.


Description

This dual inverter buffer/driver SN74LVC2G06 is designed for 1.65-V to 5.5-V V_CC operation.

The output of the SN74LVC2G06 device is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.

This device SN74LVC2G06 is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.