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SOT−223

Features: • Pb−Free Packages are AvailableApplication• Power Supplies• Converters• Power Motor Controls• Bridge CircuitsSpecifications Rating Symbol Value Unit Drain−to−Source Voltage VDSS 60 Vdc Drain−to−Gate Voltage (RG...

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SeekIC No. : 004500076 Detail

SOT−223: Features: • Pb−Free Packages are AvailableApplication• Power Supplies• Converters• Power Motor Controls• Bridge CircuitsSpecifications Rating Symbol Value ...

SOT−223 Data Sheet

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Part Number:
SOT−223
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/28

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Product Details

Description



Features:

• Pb−Free Packages are Available


Application

• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits


Specifications

Rating Symbol Value Unit
Drain−to−Source Voltage VDSS 60 Vdc
Drain−to−Gate Voltage (RGS = 10 M) VDGR 60 Vdc
Gate−to−Source Voltage
− Continuous
− Non−repetitive (tp 10 ms)		 VGS ± 20
± 30		 Vdc
Vpk
Drain Current
− Continuous @ TA = 25°C
− Continuous @ TA = 100°C
− Single Pulse (tp 10 s)		 ID
ID
IDM		 3.0
1.4
9.0		 Adc
Apk
Total Power Dissipation @ TA = 25°C (Note 1)
Total Power Dissipation @ TA = 25°C (Note 2)
Derate above 25°C		 PD 2.1
1.3
0.014		 WW
W/°C
Operating and Storage Temperature Range TJ, Tstg −55
to 175		 °C
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = 25 Vdc, VGS = 10 Vdc,
IL(pk) = 7.0 Apk, L = 3.0 mH, VDS = 60 Vdc)		 EAS 74 mJ
Thermal Resistance
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)		 RJA
RJA		 72.3
114		 °C/W
Maximum Lead Temperature for Soldering
Purposes, 1/8 from case for 10 seconds		 TL 260 °C

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
1. When surface mounted to an FR4 board using 1 pad size, 1 oz. (Cu. Area 1.127 sq in).
2. When surface mounted to an FR4 board using minimum recommended pad size, 2−2.4 oz. (Cu. Area 0.272 sq in).




Description

SOT−223,Designed for low voltage, high speed switching applications in power supplies, converters and power motor controls and bridge circuits.




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