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SP0508BAC

Features: • An Array of 4, 8 and 16 Avalanche Diodes in a ultra small Chip Scale Package (.65mm bump pitch)• ESD Capability per HBM Standards - IEC 61000-4-2, Direct Discharge................................25kV (Level 4) - IEC 61000-4-2, Air Discharge.....................................

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SeekIC No. : 004500145 Detail

SP0508BAC: Features: • An Array of 4, 8 and 16 Avalanche Diodes in a ultra small Chip Scale Package (.65mm bump pitch)• ESD Capability per HBM Standards - IEC 61000-4-2, Direct Discharge..............

SP0508BAC Data Sheet

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Part Number:
SP0508BAC
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/24

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Product Details

Description



Features:

• An Array of 4, 8 and 16 Avalanche Diodes in a ultra small Chip Scale Package (.65mm bump pitch)
• ESD Capability per HBM Standards
  - IEC 61000-4-2, Direct Discharge................................25kV (Level 4)
  - IEC 61000-4-2, Air Discharge.....................................30kV (Level 4)
  - MIL STD 833D (Method 3015.7) ...............................................30kV
• Signal line protection for applications up to 5VDC
• Fast response time...................................................................< 1ns
• Low input capacitance ....................................................39pF Typical
• Low clamp voltage ...........................................................12V Typical
• Low input leakage...............................................................10uA Max
• Operating temperature range ..................................- 40°C to 85°C


Application

• Cell phone handsets
• Personal Digital Assistants (PDA)
• Portable handheld equipment (Laptop, Palmtop computers)
• Computer port, keyboard (USB1.1)
• Set-Top Box (Audio and Video Ports)
• PCMCIA cards


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