Features: • An Array of 4, 8 and 16 Avalanche Diodes in a ultra small Chip Scale Package (0.65mm bump pitch)• ESD Capability per HBM Standards -IEC 61000-4-2, Direct Discharge .............................18kV (Level 4) - IEC 61000-4-2, Air Discharge ..................................3...
SP0508BBC: Features: • An Array of 4, 8 and 16 Avalanche Diodes in a ultra small Chip Scale Package (0.65mm bump pitch)• ESD Capability per HBM Standards -IEC 61000-4-2, Direct Discharge .............
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