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MFG:SIPEX Package Cooled:DIP

MFG:SIPEX Package Cooled:DIP

|
Parameter |
Pin |
Value |
Units | |
|
Min |
Max | |||
|
Supply voltage RF input voltage RF input DC offset Charge pump DC offset Charge pump disable Drive DC offset Crystal oscillator DC offset TEST outputs Storage temperature Junction temperature DP14 thermal resistance, chip-to-ambient DP14 thermal resistance, chip-to-case MP14 thermal resistance, chip-to-ambient MP14 thermal resistance, chip-to-case Power consumption at 5.5V |
1 2,3 2,3 8 11 7 9,10 13,14 - - - - - - - |
-0.3 - -0.3 -0.3 -0.7 -0.3 -0.3 -0.3 -55 - - - - - - |
7 2.5 VCC+0.3 VCC+0.3 VCC+0.3 VCC+0.3 VCC+0.3 VCC+0.3 150 +150 78 30 123 45 275 |
V V p-p V V V mA V V V V V V V °C °C |
SP5070
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